mass production pcbs

Currently we offer the following types of PCBs production:

Production of small and medium PCB batches

Production of small and medium PCB batches

Materials

FR4 - Huazheng Electronics, Kingboard Laminates

Mask - Fotochem FSR-8000-8

Surface - HAL SnPB; Imm/ Gold

Coating (solder pads) — Au, Ni

Processing capabilities

Number of layers — up to 8

PCB maximum size (work field size):

530х390 mm for 1L and 2L PCBs

350х250 mm for multilayr PCBs

Conductor minimum width / minimum spacing:

For foil 18 μm thick — 0.20/0.20 mm

For foil 35 μm thick — 0.24/0.24 mm

For foil 70 μm thick — 0.31/0.31 mm

For foil 105 μm thick — 0.35/0.35 mm

Hole minimum diameter / Minimum pad size on the via-hole: 0.3/0.8 mm

Minimum pad size:

For plated holes under 2/0 mm — +0.5 mm

For plated holes over 2.0 mm — +0.7 mm

Serigraphy (mask) minimum thickness — 0.15 mm

Minimum permissible mask seizure fr om the pad — 0.2 mm,
for MC pads with interval 0.5 mm - 50 μm

Minimum height of serigraphy type — 1.5 mm

Color of soldering mask (liquid) — green, white, black, red, blue

Contour mechanical processing:

Contour milling (minimum permissible PCB thickness 0.8 mm) — allowance +/-0.2 mm

Scribing (minimum permissible PCB thickness 1.0 mm) — allowance +/-0.25 mm

Copper foil thickness — 18, 35, 70, 105 μm

This is an optimal version for low-budget orders: the evident gain in price for the quality as per GOST 23752-79. A unique possibility to make use of materials of any substrate thickness / foil thickness. Advantages: short production term, low price; minimum order size – from one techological panel.

Production of large PCB batches

Production of large PCB batches

Materials

FR4, FR2

Mask - Green, blue, black, red

Marking paint - White, yellow, black

Surface - HAL, Hard Gold Fingers (0.067-1.5 μm), Carbon Ink, Ni (2.54-7.6 μm)

Processing capabilities

Number of layers — up to 18

Conductor minimum width / minimum spacing:

For foil 18 μm thick — 0.10/0.10 mm

For foil 35 μm thick — 0.15/0.15 mm

For foil 70 μm thick — 0.20/0.20 mm

For foil 105 μm thick — 0.25/0.25 mm

Hole minimum diameter / Minimum pad size on the via-hole: 0.3/0.8 mm

Minimum pad size:

For plated under 2.0 mm — +0.3 mm

For plated over 2.0 mm — +0.5 mm

Contour mechanical processing:

Contour milling — allowance +/-0.2 mm

Scribing — allowance +/-0.25 mm

Copper foil thickness — 18, 35, 70, 105 μm

Ideal combination of quality materials and a more advanced processing technology makes it possible to manufacture PCBs complying with the most stringent requirements to climatics for any field of application, as well as PCBs manufactured using lead-free technology

Apart from PCB batch production using standard materials, the Company is capable of producing in batches of non-standard and complicated PCBs including flexible and semi-lexible, PCBs with metal base, muiltilayer higher complexity PCBs and microwave PCBs.

To evaluate your order please visit "PCB calculator" or contact us at pcb@rezonit.ru.

Before you make your order consult our managers!

If you want to order production of PCBs visit "PCB Online order"